Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

被引:13
|
作者
Baruah, Ratul Kumar [1 ]
Yoo, Hocheon [2 ]
Lee, Eun Kwang [3 ]
机构
[1] Tezpur Univ, Dept Elect & Commun Engn, Tezpur 784028, Assam, India
[2] Gachon Univ, Dept Elect Engn, Seongnam 13120, South Korea
[3] Pukyong Natl Univ, Dept Chem Engn, Busan 48513, South Korea
基金
新加坡国家研究基金会;
关键词
metal routing; flexible devices; flexible metal; flexible textile; flexible circuits; plastic substrates; BATTERIES; PROGRESS; STRENGTH; SKIN; CHALLENGES; DEVICES; DESIGN; COPPER; ARRAY;
D O I
10.3390/mi14061131
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.
引用
收藏
页数:24
相关论文
共 50 条
  • [1] Edible and Nutritive Electronics: Materials, Fabrications, Components, and Applications
    Wu, Yingzhu
    Ye, Dongdong
    Shan, Yingfa
    He, Shuohai
    Su, Ziyue
    Liang, Jiahao
    Zheng, Jinren
    Yang, Zihang
    Yang, Haokai
    Xu, Wenwen
    Jiang, Hanqing
    ADVANCED MATERIALS TECHNOLOGIES, 2020, 5 (10)
  • [2] Interconnection technologies of anisotropic conductive films and their application to flexible electronics
    Matsuda, Kazuya
    Watanabe, Itsuo
    HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007, : 18 - +
  • [3] Recent Progress of Conductive Hydrogel Fibers for Flexible Electronics: Fabrications, Applications, and Perspectives
    Li, Wanwan
    Liu, Jiao
    Wei, Jingnan
    Yang, Zhaoyan
    Ren, Chunlei
    Li, Bingxiang
    ADVANCED FUNCTIONAL MATERIALS, 2023, 33 (17)
  • [4] Flexible electrode materials for emerging electronics: materials, fabrication and applications
    Liu, Kai
    Duan, Tianyi
    Zhang, Fengran
    Tian, Xiaozhu
    Li, Hui
    Feng, Min
    Wang, Rui
    Jiang, Benshuai
    Zhang, Kewei
    JOURNAL OF MATERIALS CHEMISTRY A, 2024, 12 (32) : 20606 - 20637
  • [5] Advanced polymeric materials technologies for electronics applications.
    Reichmanis, E
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 222 : U249 - U249
  • [6] Flexible Electronics: Advancements and Applications of Flexible Piezoelectric Composites in Modern Sensing Technologies
    Zhang, Jinying
    Wang, Jiacheng
    Zhong, Chao
    Zhang, Yexiaotong
    Qiu, Yajuan
    Qin, Lei
    MICROMACHINES, 2024, 15 (08)
  • [7] Handwriting flexible electronics: Tools, materials and emerging applications
    Liu, Yan
    Mo, Shuting
    Shang, Siyao
    Wang, Peng
    Zhao, Wei
    Li, Lin
    JOURNAL OF SCIENCE-ADVANCED MATERIALS AND DEVICES, 2020, 5 (04): : 451 - 467
  • [8] Green Flexible Electronics: Natural Materials, Fabrication, and Applications
    Hui, Zengyu
    Zhang, Linrong
    Ren, Guozhang
    Sun, Gengzhi
    Yu, Hai-Dong
    Huang, Wei
    ADVANCED MATERIALS, 2023, 35 (28)
  • [9] Interfacial adhesion in flexible electronics: Materials, structures and applications
    Lu, Mingyang
    You, Jia
    Gao, Mengjie
    Li, Wendong
    Zhang, Cancan
    Zhu, Bolin
    Peng, Chong
    Wu, Shiteng
    Dazhenlamu
    Ren, Wei
    Li, Guangxian
    Guo, Chuan Fei
    Yang, Junlong
    COORDINATION CHEMISTRY REVIEWS, 2025, 523
  • [10] Smart fibers and textiles for emerging clothe-based wearable electronics: materials, fabrications and applications
    Hou, Zhichao
    Liu, Xuhua
    Tian, Mingwei
    Zhang, Xueji
    Qu, Lijun
    Fan, Tingting
    Miao, Jinlei
    JOURNAL OF MATERIALS CHEMISTRY A, 2023, 11 (33) : 17336 - 17372