Research Progress of Micro-LED Display Technology

被引:12
|
作者
Zhang, Shenghao [1 ]
Zheng, Hua [1 ]
Zhou, Lv [1 ]
Li, Huadan [1 ,2 ]
Chen, Yuanrui [1 ,2 ]
Wei, Chenchen [1 ]
Wu, Tao [1 ]
Lv, Wei [1 ]
Zhang, Geng [1 ]
Zhang, Shaoqiang [1 ]
Gong, Zheng [3 ]
Jia, Baohua [1 ,4 ]
Lin, Han [1 ,4 ]
Gao, Zhiwen [5 ]
Xu, Wei [5 ]
Ning, Honglong [5 ]
机构
[1] Dongguan Univ Technol, DGUT CNAM Inst, Dongguan 523808, Peoples R China
[2] South China Normal Univ, Sch Informat & Optoelect Sci & Engn, Guangzhou 510631, Peoples R China
[3] Guangdong Acad Sci, Inst Semicond, Guangzhou 510650, Peoples R China
[4] Swinburne Univ Technol, Ctr Translat Atomat, Sch Sci, Hawthorn, Vic 3122, Australia
[5] South China Univ Technol, Sch Mat Sci & Engn, Guangzhou 510640, Peoples R China
关键词
Micro-LED; display technology; epitaxy technology; mass transfer; full-color display; bonding technology; driving technology; LIGHT-EMITTING-DIODES; DIRECT EPITAXIAL APPROACH; FULL-COLOR EMISSION; QUANTUM-DOT; MONOLITHIC INTEGRATION; FABRICATION; GROWTH; ARRAY; EFFICIENCY; RESOLUTION;
D O I
10.3390/cryst13071001
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Micro-LED display technology is considered to be the next generation of display technology, which has the characteristics of high miniaturization, thin film and integration, as well as the advantages of high brightness, high contrast, fast response speed and long service life. However, in the development of Micro-LED display technology, there are still some technical and cost problems to be solved. This paper focuses on the key technologies involved in Micro-LED display technology, such as chip technology, mass transfer, full-color display, bonding and driving technology, the research history and frontier progress of these technologies are reviewed in detail. For chip epitaxy technology, the wavelength uniformity, current density and defect control are emphasized; for chip process, the two main chip structures and the challenges brought by miniaturization are discussed emphatically; for chip integration, full-color display, backplane bonding and driving, several mainstream technical schemes are summarized in turn. Finally, the chip detection and repair technologies and commercial application are introduced.
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页数:32
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