Real-time dynamic behavior analysis of thin film during in-situ SEM tensile testing

被引:0
|
作者
Min, Hyeon-Gyu [1 ]
Park, Jun-Hyub [1 ]
机构
[1] Kyungsung Univ, Dept Mech & Automot Engn, 309 Namgu, Busan 48434, South Korea
基金
新加坡国家研究基金会;
关键词
Strain measurement; In -situ SEM; Thin film; Mechanical properties; Material behavior; SCANNING-ELECTRON-MICROSCOPY; DIGITAL IMAGE CORRELATION; LARGE-DEFORMATION MEASUREMENTS; MECHANICAL-PROPERTIES; QUANTITATIVE SMALL; MAGNIFICATIONS; FRACTURE; RATIO;
D O I
10.1016/j.heliyon.2024.e26258
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
Thin films are widely used in micro/nano-electronics. To accurately evaluate the mechanical behavior of thin films, it is important to analyze their dynamic behavior during mechanical testing in real-time. However, high -magnification SEM (Scanning Electron Microscope) images for applying strain measurement require time-consuming. In this study, we propose a method for real-time dynamic behavior analysis of thin films using in -situ SEM testing and image -based strain measurement, to obtain the mechanical properties of the thin film material to ensure reliability. We developed an in -situ SEM tensile tester that can be installed within the limited space of a chamber and optimized the magnification and resolution settings to obtain images at 1 frame per second. Therefore, we applied an image -based strain measurement method as continuously acquired high -magnification images from SEM. This method enables us to analyze the dynamic behavior of thin film materials, including failure mechanism.
引用
收藏
页数:8
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