Three-Dimensional Topography of High-Aspect Ratio Trenches by Sample-Induced Aberration-Compensable Coherence Scanning Interferometry

被引:1
|
作者
Ma, Jianqiu [1 ]
Yuan, Qun [1 ]
Gao, Zhishan [1 ]
Huo, Xiao [1 ]
Xu, Zhiyi [1 ]
Zhang, Jiale [1 ]
Fan, Xiaoxin [1 ]
Zhu, Dan [1 ]
Guo, Zhenyan [1 ]
Lei, Lihua [2 ]
Fu, Yunxia [2 ]
He, Hongtao [3 ]
Zhao, Lin [3 ]
机构
[1] Nanjing Univ Sci & Technol, Sch Elect & Opt Engn, Nanjing 210094, Peoples R China
[2] Shanghai Inst Metrol & Testing Technol, Shanghai 201203, Peoples R China
[3] 13th Inst China Elect Technol Corp, Shijiazhuang 050051, Peoples R China
来源
ACS PHOTONICS | 2024年 / 11卷 / 03期
基金
中国国家自然科学基金;
关键词
high aspect ratio; topography; sample-inducedaberration; aberration compensation; coherence scanninginterferometry; SILICON VIAS; THROUGH-SILICON; IN-LINE; FABRICATION; METROLOGY; TSVS;
D O I
10.1021/acsphotonics.3c01466
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Nondestructive three-dimensional topography of high-aspect ratio structures presents significant challenges, particularly in accurately capturing the bottom topography. Here, a sample-induced aberration-compensable near-infrared coherence scanning interferometry is proposed, with the capacity of measuring the bottom of high-aspect ratio structures and reconstructing full three-dimensional topographies. While near-infrared light penetrates the silicon to boost probe throughput, the modulation by high-aspect ratio structures defocuses the probe at the bottom. To comprehend the modulation characteristics and devise solutions, the finite element method and angular spectrum diffraction modeling are combined to analyze the high-aspect ratio sample-induced modulation, and then, a solution is devised to refocus the probe. Consequently, an aberration detection optical path integrated into the coherence scanning interferometry system is constructed. By utilizing the measured aberrations as feedback, an aberration-compensating wavefront corrector is then introduced in the test arm to refocus the probes to the bottom. The proposed method surpasses the restrictions associated with the aspect ratio in three-dimensional topography. Experiments on similar to 200 mu m-deep and similar to 20:1-aspect ratio trenches showcase simultaneous high microscopic lateral resolution and interferometric vertical precision for accurate three-dimensional high-aspect ratio trench metrology.
引用
收藏
页码:1068 / 1077
页数:10
相关论文
共 8 条
  • [1] Micro-fabrication of high-aspect ratio three-dimensional micro-components
    Farsari, M
    Claret-Tournier, F
    Chatwin, CR
    Huang, S
    Birch, PM
    Young, RC
    Budgett, DM
    Richardson, JD
    [J]. ADVANCES IN MANUFACTURING TECHNOLOGY - XIII, 1999, : 21 - 25
  • [2] Topography reconstruction of high aspect ratio silicon trench array via near-infrared coherence scanning interferometry
    Ma, Jianqiu
    Huo, Xiao
    Zhang, Jiale
    Fan, Xiaoxin
    Xu, Zhiyi
    Qiao, Wenyou
    Li, Yin
    Wang, Yuchang
    Zhu, Dan
    Guo, Zhenyan
    Yuan, Qun
    Gao, Zhishan
    [J]. OPTICS EXPRESS, 2024, 32 (13): : 22493 - 22507
  • [3] Cooperative simulation of lithography and topography for three-dimensional high-aspect-ratio etching
    Ichikawa, Takashi
    Yagisawa, Takashi
    Furukawa, Shinichi
    Taguchi, Takafumi
    Nojima, Shigeki
    Murakami, Sadatoshi
    Tamaoki, Naoki
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2018, 57 (06)
  • [4] Heat and oxygen-RIE resistant polysiloxane resist with three-dimensional structure for high-aspect ratio microfabrication
    Watanabe, K
    Igarashi, M
    Suda, S
    [J]. MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VI, 2000, 4174 : 515 - 521
  • [5] Three-dimensional span effects of high-aspect ratio synthetic jet forcing for separation control on a low Reynolds number airfoil
    Mark A. Feero
    Philippe Lavoie
    Pierre E. Sullivan
    [J]. Journal of Visualization, 2017, 20 : 45 - 51
  • [6] Three-dimensional span effects of high-aspect ratio synthetic jet forcing for separation control on a low Reynolds number airfoil
    Feero, Mark A.
    Lavoie, Philippe
    Sullivan, Pierre E.
    [J]. JOURNAL OF VISUALIZATION, 2017, 20 (01) : 45 - 51
  • [7] MEMS High Aspect Ratio Trench Three-Dimensional Measurement Using Through-Focus Scanning Optical Microscopy and Deep Learning Method
    Li, Guannan
    Shi, Junkai
    Gao, Chao
    Jiang, Xingjian
    Huo, Shuchun
    Cui, Chengjun
    Chen, Xiaomei
    Zhou, Weihu
    [J]. APPLIED SCIENCES-BASEL, 2022, 12 (17):
  • [8] Nondestructive shape process monitoring of three-dimensional, high-aspect-ratio targets using through-focus scanning optical microscopy
    Attota, Ravi Kiran
    Kang, Hyeonggon
    Scott, Keana
    Allen, Richard
    Vladar, Andras E.
    Bunday, Benjamin
    [J]. MEASUREMENT SCIENCE AND TECHNOLOGY, 2018, 29 (12)