Temperature-induced Instability of Retention Characteristics in 3-D NAND Flash Memory

被引:0
|
作者
An, Ukju [1 ]
Yoon, Gilsang [1 ]
Go, Donghyun [1 ]
Park, Jounghun [1 ]
Kim, Donghwi [1 ]
Kim, Jongwoo [1 ]
Lee, Jeong-Soo [1 ]
机构
[1] Pohang Univ Sci & Technol, Pohang 37673, South Korea
关键词
3-D NAND flash; program temperature; read temperature; retention characteristics;
D O I
10.1109/JCS57290.2023.10102959
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A temperature-induced instability of retention characteristics is observed in 3-D NAND flash. The effect of grain boundary (GB) is newly considered to investigate the retention characteristics at different program temperature ( T-PGM) and read temperature (T-READ). At high TPGM, the decrease of threshold voltage (V-T) is reduced. As the difference between T-PGM and T-READ increases, V-T change after 4 h varies linearly from negative to positive value due to the increase of the GB effect.
引用
收藏
页数:3
相关论文
共 50 条
  • [1] Investigation of Retention Noise for 3-D TLC NAND Flash Memory
    Wang, Kunliang
    Du, Gang
    Lun, Zhiyuan
    Liu, Xiaoyan
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2019, 7 (01) : 150 - 157
  • [2] TCAD Simulation of Data Retention Characteristics of Charge Trap Device for 3-D NAND Flash Memory
    Oh, Dongyean
    Lee, Bonghoon
    Kwon, Eunmee
    Kim, Sangyong
    Cho, Gyuseog
    Park, Sungkye
    Lee, Seokkiu
    Hong, Sungjoo
    2015 IEEE 7TH INTERNATIONAL MEMORY WORKSHOP (IMW), 2015, : 113 - 116
  • [3] Novel Dummy Cell Programming Scheme to Improve Retention Characteristics in 3-D NAND Flash Memory
    Kim, Donghwi
    Yoon, Gilsang
    Go, Donghyun
    Park, Jounghun
    Kim, Jungsik
    Lee, Jeong-Soo
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (08) : 4644 - 4648
  • [4] Impact of Self-Heating Effect on the Retention of 3-D NAND Flash Memory
    Wang, Kunliang
    Lun, Zhiyuan
    Chen, Wangyong
    Liu, Xiaoyan
    Du, Gang
    2017 IEEE 24TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2017,
  • [5] Impact of Cycling Induced Intercell Trapped Charge on Retention Charge Loss in 3-D NAND Flash Memory
    Jia, Xinlei
    Jin, Lei
    Hou, Wei
    Wang, Zhiyu
    Jiang, Songmin
    Li, Kaiwei
    Huang, Dejia
    Liu, Hongtao
    Wei, Wenzhe
    Lu, Jianwei
    Zhang, An
    Huo, Zongliang
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2020, 8 (01) : 62 - 66
  • [6] CHARACTERIZATION OF RELIABILITY IN 3-D NAND FLASH MEMORY
    Lee, Jong-Ho
    Joe, Sung-Min
    Kang, Ho-Jung
    2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2014,
  • [7] Effects of Poly-Si Grain Boundary on Retention Characteristics under Cross-Temperature Conditions in 3-D NAND Flash Memory
    An, Ukju
    Yoon, Gilsang
    Go, Donghyun
    Park, Jounghun
    Kim, Donghwi
    Kim, Jongwoo
    Lee, Jeong-Soo
    MICROMACHINES, 2023, 14 (12)
  • [8] Investigation of Endurance Characteristics in 3-D nand Flash Memory With Trap Profile Analysis
    Jo, Hyungjun
    Kim, Jongwoo
    Cho, Yonggyu
    Shim, Hyunyoung
    Sim, Jaesung
    Shin, Hyungcheol
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (03) : 1852 - 1857
  • [9] Heavy Ion and Proton-Induced Single Event Upset Characteristics of a 3-D NAND Flash Memory
    Chen, Dakai
    Wilcox, Edward
    Ladbury, Raymond L.
    Seidleck, Christina
    Kim, Hak
    Phan, Anthony
    Label, Kenneth A.
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2018, 65 (01) : 19 - 26
  • [10] Vertical and lateral charge losses during short time retention in 3-D NAND flash memory
    Lee, Yongwoo
    Yoon, Jinsu
    Lim, Kwangmin
    Choi, Bongsik
    Park, Geon-Hwi
    Jeon, Ju Won
    Bae, Jong-Ho
    Kim, Dong Myong
    Kim, Dae Hwan
    Kwon, Eunmee
    Choi, Sung-Jin
    IEEE 51ST EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2021), 2021, : 279 - 282