Application of Ag@Cu Water-Based Nanomaterial Conductive Ink in 3D Printing

Copper (Cu) nanoparticles are considered a promising alternative to silver (Ag) and gold (Au) for printed electronics applications. Because Cu has higher electrical conductivity, it is significantly cheaper than Ag and Au. To study the applicability of electronic printing, we prepared Ag@Cu conductive ink by using a stepwise feeding method to disperse nano Ag and nano Cu in ethanol and water. The ink has the advantages of nontoxic, low content, and low cost. A three-dimensional (3D) model was designed, and a conductive pattern was printed on the photo paper substrate using extrusion 3D printing technology. The influence of waterborne resin on the adhesion of conductive patterns is discussed. The printed conductive pattern can maintain the stability of conductivity after 100 bending cycles. The conductive pattern has good thermal stability. It can be tested 10 times under 2 conditions of 85 degrees C and room temperature to maintain good conductivity. This shows that Ag@Cu conductive ink printed flexible electronic products are competitive.