Evaluating the depth resolution of 3D sensors for manufacturing automation applications

被引:2
|
作者
Rachakonda, Prem [1 ]
Cheok, Geraldine [1 ]
Franaszek, Marek [1 ]
Saidi, Kamel [1 ]
机构
[1] NIST, Intelligent Syst Div, Sensing & Percept Syst Grp, Gaithersburg, MD 20899 USA
关键词
ASTM E57; 3D imaging systems; Documentary standards; Depth resolution;
D O I
10.1016/j.measurement.2023.113307
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The Intelligent Systems Division (ISD) at the National Institute of Standards and Technology (NIST) is performing research to support the development of documentary standards within ASTM subcommittee E57.23 on Industrial 3D Machine Vision Systems. This subcommittee is addressing the performance evaluation of 3D imaging systems that are used for manufacturing automation and vision guided robotics. The applications of these systems extend to other areas such as robotic bin picking, autonomous vehicles, 3D reconstruction, and entertainment. This paper discusses the activities of one work item (WK73176) that is addressing the evaluation of the depth resolution of a 3D imaging system. The key contributions of this paper include the description of multiple methods to determine the resolution of a 3D imaging system.
引用
收藏
页数:16
相关论文
共 50 条
  • [1] Manufacturing of 3D Integrated Sensors and Circuits
    Schrems, Martin
    Siegert, Joerg
    Dorfi, Peter
    Kraft, Jochen
    Stueckler, Ewald
    Schrank, Franz
    Selberherr, Siegfried
    [J]. PROCEEDINGS OF THE 2014 44TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2014), 2014, : 162 - 165
  • [2] Evaluating Depth Perception of 3D Stereoscopic Videos
    Lebreton, Pierre
    Raake, Alexander
    Barkowsky, Marcus
    Le Callet, Patrick
    [J]. IEEE JOURNAL OF SELECTED TOPICS IN SIGNAL PROCESSING, 2012, 6 (06) : 710 - 720
  • [3] A 3D image processing method for manufacturing process automation
    Zhao, DM
    Li, ST
    [J]. COMPUTERS IN INDUSTRY, 2005, 56 (8-9) : 975 - 985
  • [4] Depth Image Improvement for 3D Applications
    Ahn, Yangkeun
    Hong, Jiman
    [J]. 2011 INTERNATIONAL CONFERENCE ON COMPUTER SCIENCE AND NETWORK TECHNOLOGY (ICCSNT), VOLS 1-4, 2012, : 218 - 222
  • [5] Additive manufacturing for 3d electronic applications
    Maruo S.
    [J]. Maruo, Shoji, 1600, Japan Institute of Electronics Packaging (23): : 452 - 458
  • [6] A CMOS 3D camera with millimetric depth resolution
    Niclass, C
    Rochas, A
    Besse, PA
    Charbon, E
    [J]. PROCEEDINGS OF THE IEEE 2004 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2004, : 705 - 708
  • [7] 3D silicon sensors with variable electrode depth for radiation hard high resolution particle tracking
    Da Via, C.
    Borri, M.
    Dalla Betta, G.
    Haughton, I.
    Hasi, J.
    Kenney, C.
    Povoli, M.
    Mendicino, R.
    [J]. JOURNAL OF INSTRUMENTATION, 2015, 10
  • [8] Investigation of the time resolution of 3D silicon sensors
    Diehl, L.
    Ferrer, O.
    Hauser, M.
    Jakobs, K.
    King, M.
    Kramberger, G.
    Moffat, N.
    Parzefall, U.
    Pellegrini, G.
    Sperlicha, D.
    [J]. JOURNAL OF INSTRUMENTATION, 2022, 17 (12):
  • [9] 3D Modelling Using Depth Sensors Present in Kinect
    Radhika, G.
    Ramkumar, S.
    Prasath, K. Narasimha
    [J]. PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON SOFT COMPUTING SYSTEMS, ICSCS 2015, VOL 1, 2016, 397 : 351 - 359
  • [10] HYBRID ADDITIVE MANUFACTURING OF 3D COMPLIANT TACTILE SENSORS
    Vatani, Morteza
    Engeberg, Erik D.
    Choi, Jae-Won
    [J]. PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 2A, 2014,