A well-balanced strength and electrical conductivity in rolled composite prepared by in- situ TiB2p/Cu composite powder

被引:5
|
作者
Shi, Hao [1 ,2 ,3 ]
Cao, Fei [1 ,2 ,3 ]
Wang, Tongle [1 ,2 ,3 ]
Zhang, Haidong [1 ,2 ,3 ]
Gao, Huaibao [4 ]
Liu, Haotian [1 ,2 ,3 ]
Gao, Lei [1 ,2 ,3 ]
Zou, Juntao [1 ,2 ,3 ]
Jiang, Yihui [1 ,2 ,3 ]
Liang, Shuhua [1 ,2 ,3 ]
机构
[1] Xian Univ Technol, Sch Mat Sci & Engn, Xian 710048, Shaanxi, Peoples R China
[2] Minist Educ, Engn Res Ctr Conducting Mat & Composite Technol, Xian 710048, Shaanxi, Peoples R China
[3] Shaanxi Prov Key Lab Elect Mat & Infiltrat Techno, Xian 710048, Shaanxi, Peoples R China
[4] Western Superconducting Technol Co Ltd, Natl Engn Lab Superconducting Mat, Xian 710018, Shaanxi, Peoples R China
基金
中国国家自然科学基金;
关键词
Current -assisted sintering; Rolling; Grain refinement; Strengthening mechanism; In-situTiB2p/Cu composite; MATRIX COMPOSITES; CU; MICROSTRUCTURES; DEFORMATION; BEHAVIOR; NANOCOMPOSITES; DISPERSION; PARTICLES; ALLOYS;
D O I
10.1016/j.jmrt.2023.09.193
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The TiB2p/Cu composites were prepared by current-assisted vacuum hot pressing (CAVHP) combined with rolling using in-situ spherical TiB2p/Cu composite powder as raw material. The effects of rolling deformation on the microstructure and properties of the sintered TiB2p/Cu composite were investigated. The results show that CAVHP leads to a rapid densification of the composite powder compact, and the subsequent rolling deformation is able to eliminate the unclosed pores and achieve a uniform distribution of TiB2p. The dynamic recrystallization during cold rolling refines the Cu matrix grains to ultrafine grains with an average grain size of 0.47 mm. The cold rolled TiB2p/Cu composite obtains a remarkable comprehensive performance with ultimate tensile strength, yield strength and electrical conductivity of 621 MPa, 567 MPa and 86.3% IACS, respectively. In addition, the strengthening and fracture mechanism of the cold rolled TiB2p/Cu composite are analyzed. This work will explore a new technological solution for the preparation of highperformance Cu matrix composites. (c) 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页码:1 / 10
页数:10
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