Enhancing ball grid array (BGA) component design and reliability using a novel reliability-based design optimization (RBDO) methodology

被引：2
|
作者：
Ghenam, Sinda [1 ,2 ,3 ]
El Hami, Abdelkhalak [1 ]
Dammak, Khalil [1 ]
Gafsi, Wajih [2 ]
Akrout, Ali [2 ]
Haddar, Mohamed [2 ]
机构：
[1] Natl Inst Appl Sci Rouen INSA Rouen, Lab Mech Normandy LMN, Rouen, France
[2] Univ Sfax, Natl Sch Engineers Sfax ENIS, Lab Mech Modelling & Prod LA2MP, Sfax, Tunisia
[3] 53 Rue Kennedy, F-57950 Montigny Les Metz, France
来源：
MECHANICS OF ADVANCED MATERIALS AND STRUCTURES | 2023年
关键词：
Solder joints; electro-thermomechanical loading; reliability-based design optimization; optimal performance; cost-effective; SOLDER JOINTS; FATIGUE-LIFE; EXTENSION;
D O I：
10.1080/15376494.2023.2237694
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In industry and research areas, the importance of reliable and optimally designed BGA components has remarkably grown. To tackle this challenge, we elaborated an innovative approach that optimizes of the BGA's structure. By adopting the RBDO method, we assess the geometric design variables of the BGA component and determine the optimal variables that promote the structure's efficiency level. Our approach considers technical and economic feasibility, ensuring an optimal design of the BGA solder joints. This work rests upon coupling Ansys and MATLAB software. The current paper reports our investigation's results, highlighting our approach's benefits and potential for practical applications.
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收藏
页数：17
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