Jet Impingement Boiling on Monocrystalline Silicon Surfaces with Open Microchannels

Thermal management of electronic devices with great critical heat flux (CHF) and lower wall temperature is critical issues. To address it, the cooling method based on jet impingement boiling is experimentally explored. The effects of heat surface modification, vertical expansion angle of flow microchannels, and negative back pressure are emphasized. The vertical expansion angle, flow rate and average pressure are 0 degrees-30 degrees, 10-30 L/h, and 0.04-0.1 MPa, respectively. It is found that the CHF changes non-monotonically with the increase of the vertical expansion angle of the open flow microchannel since both flow resistance and bubble detachment performance. A maximum CHF reaches at 381 W/cm(2) for the jet impingement boiling on a modified monocrystalline silicon surface with microcolumns under the condition of open microchannels with the vertical expansion angle of 20 degrees and the pressure of 0.1 MPa. Moreover, compared with 0.04 MPa, a greater pressure of 0.1 MPa increases the boiling temperature, thus inhibiting explosive boiling and enhancing the CHF.