Low-Profile 5G mmWave Antenna-in-Package with Dual-Polarization Operation

被引:0
|
作者
Magray, M. Idrees [1 ]
Su, Saou-Wen [1 ]
Juan, Peng-Hao [1 ]
Lu, Jui-Han [2 ]
机构
[1] ASUSTek Comp Inc, Antenna Design Dept, Adv EM & Wireless Commun R&D R&D Ctr, Taipei 11259, Taiwan
[2] Natl Kaohsiung Univ Sci & Technol, Dept Elect Commun Engn, Kaohsiung, Taiwan
关键词
antenna-in-package (AiP); 5G mmWave; dual-polarization; low profile; end-fire radiation; 28; GHz;
D O I
10.1109/APMC57107.2023.10439688
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A compact 5G mmWave antenna-in-package (AiP) with a low-profile 5-layered substrate is proposed in this conference paper. A very thin liquid crystal polymer (LCP) substrate topology is utilized with an overall thickness of 0.5 mm (around 0.05 lambda(0) at 28 GHz) only. The proposed antenna is dual-polarized and with a shorted patch radiator and a magnetic dipole radiator, which respectively contribute to the horizontal polarization (H-pol) and the vertical polarization (V-pol). For H-pol, the shorted patch radiator is excited by aperture coupled feeding via dual slots present in the ground plane. Additionally, two resonant TM1/(Z)(2,0,0) and TM1,0,0Z modes are excited in the patch that aids in the wideband coverage. For V-pol, the microstrip magnetic dipole radiator is fed by the coaxial feedline and loaded with a reflector behind the dipole to improve the front-to-back ratio. Both the orthogonal antenna ports cover the n257 5G mmWave frequency band (26.5-29.5 GHz). An optimal peak gain of more than 7.5 dBi is achieved for both antenna ports.
引用
收藏
页码:444 / 446
页数:3
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