Recent progress on thermal conductivity of graphene filled epoxy composites

被引:0
|
作者
Ruicong Lv [1 ]
Yanjuan Ren [1 ]
Haichang Guo [1 ]
Shulin Bai [1 ]
机构
[1] School of Materials Science and Engineering,HEDPS/Center for Applied Physics and Technology,Key Laboratory of Polymer Chemistry and Physics of Ministry of Education,Peking University
关键词
D O I
暂无
中图分类号
TB332 [非金属复合材料];
学科分类号
0805 ; 080502 ;
摘要
With the rapid development of the electronic industry, the requirements for packaging materials with high thermal conductivity(TC) are getting higher and higher. Epoxy is widely used as package material for electronic package applications. But it’s intrinsic TC can’t meets the increasing demands. Adding high TC graphene into epoxy matrix is a proper way to reinforce epoxy composites. This review focuses on the filler modification,preparation process and thermal properties of graphene-filled epoxy resin composites. Different ways of covalent and non-covalent modification methods are discussed. The various kinds of graphene coating layer are also summarized. Then we analysis the hybrid filler system in epoxy composite. We hope this review will provide guidance for the development and application of graphene-filled epoxy resin composites.
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页码:205 / 219
页数:15
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