共 10 条
- [1] Characterization of the effects of nitrogen and hydrogen passivation on SiO2/4H-SiC interface by low temperature conductance measurements[J]. 王弋宇,彭朝阳,申华军,李诚瞻,吴佳,唐亚超,赵艳黎,陈喜明,刘可安,刘新宇.Journal of Semiconductors. 2016(02)
- [2] Development of 10 kV 4H-SiC JBS diode with FGR termination[J]. 黄润华,陶永洪,曹鹏飞,汪玲,陈刚,柏松,栗瑞,李赟,赵志飞.Journal of Semiconductors. 2014(07)
- [3] Ultrahigh-Voltage (> 20 kV) SiC PiN Diodes with a Space-Modulated JTE and Lifetime Enhancement Process via Thermal Oxidation[J] . Naoki Kaji,Hiroki Niwa,Jun Suda,Tsunenobu Kimoto.Materials Science Forum . 2014 (778)
- [4] Simulation, Fabrication and Characterization of 4500V 4H-SiC JBS Diode[J] . Run Hua Huang,Gang Chen,Song Bai,Rui Li,Yun Li,Yong Hong Tao.Materials Science Forum . 2014 (778)
- [5] Study of 4H-SiC Schottky Diode Designs for 3.3kV Applications[J] . Holger Bartolf,Vinoth Sundaramoorthy,Andrei Mihaila,Maxime Berthou,Philippe Godignon,José Millán.Materials Science Forum . 2014 (778)
- [6] Area-Optimized JTE for 4.5 kV Non Ion-Implanted 4H-SiC BJT[J] . Takeshi Mitani,Masayuki Okamura,Tetsuo Takahashi,Naoyoshi Komatsu,Tomohisa Kato,Hajime Okumura.Materials Science Forum . 2013 (740)
- [7] Evaluation of Termination Techniques for 4H-SiC Pin Diodes and Trench JFETs[J] . Mihaila Andrej,Udrea F.,Rashid S.J.,Amaratunga G.,Kataoka Mitsuhiro,Takeuchi Yuuichi,Malhan Rajesh Kumar.Materials Science Forum . 2007 (556)
- [8] High Voltage Silicon Carbide Schottky Diodes with Single Zone Junction Termination Extension[J] . Vassilevski Konstantin,Nikitina Irina P.,Horsfall Alton B.,Wright Nicolas G.,O’Neill Anthony G.,Hilton Keith P.,Munday A.G.,Hydes A.J.,Uren Michael J.,Johnson C. Mark.Materials Science Forum . 2007 (556)
- [9] Design, Fabrication and Characterization of 5 kV 4H-SiC p+n Planar Bipolar Diodes Protected by Junction Termination Extension[J] . Raynaud Christophe,Lazar Mihai,Planson Dominique,Chante Jean-Pierre,Sassi Z..Materials Science Forum . 2004 (457)
- [10] Optimization of JTE Edge Terminations for 10 kV Power Devices in 4H-SiC[J] . Wang X.,Cooper James A..Materials Science Forum . 2004 (457)