Thermal analysis of LED lighting system with different fin heat sinks

被引：0
|
作者：
侯峰泽 [1 ]
杨道国 [1 ]
张国旗 [1 ,2 ]
机构：
[1] School of Mechanical & Electrical Engineering Guilin University of Electronic Technology
[2] philips Lighting,Eindhoven,the Netherlands
来源：
Journal of Semiconductors | 2011年 / 32卷 / 01期
基金：
中国国家自然科学基金;
关键词：
LED; thermal design; LED array; heat sink;
D O I：
暂无
中图分类号：
TM923.34 [半导体发光灯];
学科分类号：
0803 ; 080801 ;
摘要：
This paper designs a 3×3 light emitting diode(LED) array with a total power of 9 W,presents a thermal analysis of plate fin,in-line and staggered pin fin heat sinks for a high power LED lighting system,and develops a 3D one-fourth finite element(FE) model to predict the system temperature distribution.Three kinds of heat sinks are compared under the same conditions.It is found that LED chip junction temperature is 48.978℃when the fins of heat sink are aligned alternately.
引用
收藏
页码：50 / 52
页数：3
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