Finite element analysis on factors influencing the clamping force in an electrostatic chuck

被引：0

作者：

王兴阔 ^{[1
]}

程嘉 ^{[2
]}

王珂晟 ^{[2
,3
]}

杨义勇 ^{[1
]}

孙钰淳 ^{[2
]}

曹明路 ^{[2
]}

季林红 ^{[2
]}

机构：

[1] School of Engineering and Technology, China University of Geosciences (Beijing)

[2] Department of Mechanical Engineering, Tsinghua University

[3] Department of Mechanical Engineering, Academy of Armored Force Engineering of PLA

来源：

Journal of Semiconductors | 2014年 / 09期

关键词：

electrostatic chuck; clamping force; COMSOL simulation; orthogonal experiment;

D O I：

暂无

中图分类号：

O441.1 [电学];

学科分类号：

0809 ;

摘要：

As one of the core components of IC manufacturing equipment, the electrostatic chuck (ESC) has been widely applied in semiconductor processing such as etching, PVD and CVD. The clamping force of the ESC is one of the most important technical indicators. A multi-physics simulation software COMSOL is used to analyze the factors influencing the clamping force. The curves between the clamping force and the main parameters such as DC voltage, electrode thickness, electrode radius, dielectric thickness and helium gap are obtained. Moreover, the effects of these factors on the clamping force are investigated by means of orthogonal experiments.The results show that the factors can be ranked in order of voltage, electrode radius, helium gap and dielectric thickness according to their importance, which may offer certain reference for the design of ESCs.

引用

页码：91 / 95

页数：5