Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

被引：0
|
作者：
Xueren Zhang Tong Yan Tee Jingen Luan ST Microelectronics Lorong Toa Payoh Singapore [629 ,46 ,319521 ]
机构：
来源：
电子与封装 | 2006年 / 02期
关键词：
Warpage analysis; Stacked die MEMS package; Accelerometer application;
D O I：
10.16257/j.cnki.1681-1070.2006.02.003
中图分类号：
TH824.4 [];
学科分类号：
摘要：
<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.
引用
收藏
页码：10 / 15+4 +4
页数：7
相关论文
共 5 条
  • [1] Finite element simulation of package stress in transfer molded MEMS pressure sensors. Krondorfer R,Kim YK,Kim J. Microelectronics Reliability . 2004
  • [2] Reliability of MEMS-a methodical approach. Muller-Fiedler R,Wagner U,Bernhard W. Microelectronics Reliability . 2002
  • [3] Chip scale packaging for a MEMS accelerometer. Felton LE,Hablutzel N,Webster WA,Harney KP. Proc. of 54th ECTC Conference, Las Vegas . 2004
  • [4] Low stress packaging of a micromachined accelerometer. Li G,Tseng AA. IEEE Trans. on Electronics Packaging Manufacturing . 2001
  • [5] Coupled package-device modeling for microelectromechanical systems. Bart SF,Zhang S,Rabinovich VL,Cunningham S. Microelectronics Reliability . 2000
1