MOLECULAR DYNAMICS SIMULATION OF POLISHING PROCESS BASED ON COUPLING VIBRATIONS OF LIQUID

被引：2
|
作者：
HUANG Zhigang GUO Zhongning CHENG Xing Faculty of Electromechanical Engineering
机构：
来源：
Chinese Journal of Mechanical Engineering | 2006年 / 01期
基金：
中国国家自然科学基金;
关键词：
Molecular dynamics simulation Ultra-smooth polishing Ultrasonic vibration;
D O I：
暂无
中图分类号：
TG73 [磨料];
学科分类号：
080201 ;
摘要：
Molecular dynamics method is applied to study the machining mechanisms of polishing based on coupling vibrations of liquid. The physical phenomena of abrasive particles bombarding on silicon monocrystal surface are simulated using Tersoff potentials. The effects of vibration parameters, particle size, incident angle and panicle material are analyzed and discussed. Material removal mechanisms are studied. Deformation and embedment phenomena are found in the simulations. Bombardment will destroy the crystal structures near the impact point, and adhesion effect is responsible for final removal of material.
引用
收藏
页码：19 / 24
页数：6
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