High-performance germanium n~+/p junction by nickel-induced dopant activation of implanted phosphorus at low temperature

被引:0
|
作者
黄巍 [1 ]
陆超 [1 ]
余珏 [1 ]
魏江镔 [1 ]
陈超文 [1 ]
汪建元 [1 ]
徐剑芳 [1 ]
王尘 [2 ]
李成 [1 ]
陈松岩 [1 ]
刘春莉 [3 ]
赖虹凯 [1 ]
机构
[1] Department of Physics, Semiconductor Photonics Research Center, Xiamen University
[2] Department of Physics and Oxide Research Center, Hankuk University of Foreign Studies
[3] Xiamen University of Technology
基金
中国国家自然科学基金;
关键词
germanium; metal-induced dopant activation; NiGe; n+/P junction;
D O I
暂无
中图分类号
TN386 [场效应器件];
学科分类号
0805 ; 080501 ; 080502 ; 080903 ;
摘要
High-performance Ge n~+/p junctions were fabricated at a low formation temperature from 325℃ to 400℃ with a metal(nickel)-induced dopant activation technique. The obtained Ni Ge electroded Ge n+/p junction has a rectification ratio of 5.6×10~4 and a forward current of 387 A/cm~2at -1 V bias. The Ni-based metal-induced dopant activation technique is expected to meet the requirement of the shallow junction of Ge MOSFET.
引用
收藏
页码:316 / 319
页数:4
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