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High-performance germanium n~+/p junction by nickel-induced dopant activation of implanted phosphorus at low temperature
被引:0
|作者:
黄巍
[1
]
陆超
[1
]
余珏
[1
]
魏江镔
[1
]
陈超文
[1
]
汪建元
[1
]
徐剑芳
[1
]
王尘
[2
]
李成
[1
]
陈松岩
[1
]
刘春莉
[3
]
赖虹凯
[1
]
机构:
[1] Department of Physics, Semiconductor Photonics Research Center, Xiamen University
[2] Department of Physics and Oxide Research Center, Hankuk University of Foreign Studies
[3] Xiamen University of Technology
基金:
中国国家自然科学基金;
关键词:
germanium;
metal-induced dopant activation;
NiGe;
n+/P junction;
D O I:
暂无
中图分类号:
TN386 [场效应器件];
学科分类号:
0805 ;
080501 ;
080502 ;
080903 ;
摘要:
High-performance Ge n~+/p junctions were fabricated at a low formation temperature from 325℃ to 400℃ with a metal(nickel)-induced dopant activation technique. The obtained Ni Ge electroded Ge n+/p junction has a rectification ratio of 5.6×10~4 and a forward current of 387 A/cm~2at -1 V bias. The Ni-based metal-induced dopant activation technique is expected to meet the requirement of the shallow junction of Ge MOSFET.
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页码:316 / 319
页数:4
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