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Build-up Materials APL Series
被引：0
|作者：
Hiroshi HAYAI
Takamasa AKAMATSU
Toshio KOMIYATANI
机构：
[1] LTD. CIRCUTTRY MATERIAL RESEARCH LABORATORY
[2] SUMITOMO BAKELITE CO
来源：
关键词：
APL;
ab;
Build-up Materials APL Series;
印制电路;
印刷电路;
D O I：
暂无
中图分类号：
TN405 [制造工艺];
学科分类号：
080903 ;
1401 ;
摘要：
In recent years the high efficiency of small and light weight electronic devices has been progressing and the multilayer printed wiring board in connection with this have been progressing as well, becoming many pins or a narrow pitch. The build-up board, which makes high-density and narrow pitch possible, is basking in the limelight of this progression trend. (Fig 1) Now, many methods of construction of these build-up boards is advocat-
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页码：26 / 30
页数：5
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