A low-fabrication-temperature, high-gain chip-scale waveguide amplifier

被引:0
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作者
Bo WANG [1 ]
Peiqi ZHOU [1 ,2 ]
Xingjun WANG [1 ,3 ,4 ,5 ]
Yandong HE [2 ]
机构
[1] State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronics,School of Electronics Engineering and Computer Science, Peking University
[2] Institute of Microelectronics, School of Electronics Engineering and Computer Science, Peking University
[3] Frontier Science Center for Nano-optoelectronics, Peking University
[4] Peking University Yangtze Delta Institute of Optoelectronics
[5] Peng Cheng Laboratory
基金
中国国家自然科学基金;
关键词
D O I
暂无
中图分类号
TN722 [放大器];
学科分类号
摘要
The increasing prevalence of integrated on-chip optoelectronic devices has identified serious issues regarding inter-device transmission and coupling losses, highlighting an urgent need for on-chip waveguide amplifiers to compensate for these losses. Compared with other Er-based optical materials, erbium silicate is ideally suited to high-efficiency on-chip amplifiers and lasers because of its extremely high Er3+concentration(1022cm-3). Nevertheless, erbium silicate must be annealed above 1000℃ to crystallize and activate the Er3+, which damages other on-chip optoelectronic components and is not conducive to device integration.Here, we report a low-fabrication-temperature, high-luminescence-efficiency gain material by adding Bi2O3to an erbium-ytterbium silicate mixed film. Our experiments demonstrate that the proposed film crystallizes at 600℃ while the activation of Er3+is also achieved, which is the lowest activation temperature of on-chip waveguide amplifier to our knowledge. This material forms the basis for a new chip-scale waveguide amplifier design, with a theoretical multi-energy-level model of Bi-Er-Yb in the mixed thin films used to analyze its signal enhancement properties. We achieve a peak on-chip gain of 23 dB in a 3.3-mm-long waveguide under the pump and signal powers of 300 mW and 1 μW, respectively. These results highlight the potential of the proposed material for realizing on-chip amplifiers and lasers for large-scale nanophotonic integrated circuits.
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页码:247 / 255
页数:9
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