STUDY ON THE THRESHOLD VALUE OF CERAMIC MICROCRACK PROPAGATION

被引：0
|
作者：
宋显辉
郑兆佳
机构：
来源：
JournalofWuhanUniversityofTechnology-MaterialsScience | 1994年 / 03期
关键词：
engineering ceramic; fatigue Limit; crack propagation;
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业];
学科分类号：
摘要：
The fatigue behavior of alumina and silicon car-bide has been investigated in this paper.Once visiable macrocrack on ceramic materials appears,the specimen ruptures due tothe high speed of crack propagation and small ultimate strain.It is indicated that the bending fatigue,limit is equal tothreshod value of surface micro crack propagation and is deter-mined by the original defects and grain boundary force of mate-rials.For ceramic materials,the crack growth is controlled bythe applied stress.By measuring the macroscopic residualstrength,we can determine whether the micro-crack is expand-ing and calculate the growth rate of mico-crack.
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页码：40 / 44
页数：5
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