The Evolution of Wafer Bonding Moving from the back-end further to the front-end

被引：0

作者：

Thomas Glinsner ^{[1
]}

Peter Hangweier ^{[2
]}

机构：

[1] Head of Product Management,EV Group

[2] Product Manager,EV Group

来源：

电子工业专用设备 | 2009年 / 38卷 / 03期

关键词：

EV; The Evolution of Wafer Bonding Moving from the back-end further to the front-end; MEMS; GaAs; TSV;

D O I：

暂无

中图分类号：

TB383.1 [];

学科分类号：

070205 ; 080501 ; 1406 ;

摘要：

1 IntroductionAs the nanoscale era progresses, innovative new materials and processes continue to be developed and implemented as a means of keeping the industry on

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页码：20 / 26

页数：7