The Evolution of Wafer Bonding Moving from the back-end further to the front-end

被引:0
|
作者
Thomas Glinsner [1 ]
Peter Hangweier [2 ]
机构
[1] Head of Product Management,EV Group
[2] Product Manager,EV Group
关键词
EV; The Evolution of Wafer Bonding Moving from the back-end further to the front-end; MEMS; GaAs; TSV;
D O I
暂无
中图分类号
TB383.1 [];
学科分类号
070205 ; 080501 ; 1406 ;
摘要
1 IntroductionAs the nanoscale era progresses, innovative new materials and processes continue to be developed and implemented as a means of keeping the industry on
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页码:20 / 26
页数:7
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