2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering(SMILE 2018) & 2018 International Symposium on Semiconductor Manufacturing Intelligence(ISMI2018)

被引：0

作者：

Chen-Fu Chien

机构：

[1] Taiwan"TsingHuaUniversity"

来源：

工业工程 | 2017年 / 20卷 / 04期

关键词：

IEEE International Conference on Smart Manufacturing; ISMI2018; Industrial; International Symposium on Semiconductor Manufacturing Intelligence; Logistics Engineering;

D O I：

暂无

中图分类号：

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学科分类号：

摘要：

<正>February 7-9,2018 Hsinchu,Taiwan http://smile.ieeng.org/Aims and Topics:The joint conference of 2018 IEEE International Conference on Smart Manufacturing,Industrial&Logistics Engineering(SMILE 2018)and 2018 International Symposium on Semiconductor Manufacturing Intelligence(ISMI2018)aims to disseminate the recent theoretical and methodological developments,significant technical applications,case studies and survey results in the areas of manufacturing informatics,manufacturing intelligence,Big data analytics&data mining,modeling and decision analysis,Internet of Things,green supply chains and intelligent logistics,yet not limited,the following topics:

引用

页码：2 / 2

页数：1