Finite element model analysis of thermal failure in connector附视频

被引:0
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作者
WANG Xin XU Liangjun Research Lab of Electric Contacts Beijing University of Posts Telecommunications Beijing China [100876 ]
机构
关键词
Connector; Stress relaxation; Finite element method (FEM); Thermal failure;
D O I
暂无
中图分类号
TM503.5 [];
学科分类号
摘要
Thermal analysis and thermal diagnose are important for small power connector especially in electronic devices since their structure is usually compact. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and that increased contact resistance produced more Joule heating; this mutual action causes the connector to lose efficiency. The thermal distribution in the connector was analyzed using finite element method (FEM). The failure mechanism is discussed. It provides basis for improving the structure. The conclusion was verified by experimental results.
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页码:397 / 402
页数:6
相关论文
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  • [1] Computer simulation of impression creep by the finite element method[J] . Hsiang-Yung Yu,J. C. M. Li.Journal of Materials Science . 1977 (11)