Les Houches 2022 Special Issue: Editorial

被引:0
|
作者
Krzakala, Florent [1 ]
Zdeborova, Lenka [2 ]
机构
[1] Ecole Polytech Fed Lausanne EPFL, Informat Learning & Phys Lab, CH-1015 Lausanne, Switzerland
[2] Ecole Polytech Fed Lausanne EPFL, Stat Phys Computat Lab, CH-1015 Lausanne, Switzerland
基金
瑞士国家科学基金会; 欧洲研究理事会;
关键词
D O I
10.1088/1742-5468/ad4e2a
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
引用
收藏
页数:15
相关论文
共 50 条
  • [1] Editorial Special Issue 2022
    Rahel M. Schomaker
    Stoyan Panov
    European Journal for Security Research, 2022, 7 (2) : 113 - 115
  • [2] Correction to: Editorial Special Issue 2022
    Rahel M. Schomaker
    Stoyan Panov
    European Journal for Security Research, 2022, 7 (2) : 237 - 237
  • [3] Editorial to the special issue on JCDL 2022
    Mayr, Philipp
    Hinze, Annika
    Schaer, Philipp
    INTERNATIONAL JOURNAL ON DIGITAL LIBRARIES, 2024, 25 (02) : 237 - 240
  • [4] Editorial Special Issue on OMN 2022
    Piyawattanametha, Wibool
    Ferhanoglu, Onur
    Zhang, John X. J.
    IEEE PHOTONICS TECHNOLOGY LETTERS, 2023, 35 (16) : 878 - 878
  • [5] Editorial - Special issue for the 2022 ICSSA
    不详
    ACTA ASTRONAUTICA, 2023, 202 : 899 - 899
  • [6] Ants 2022 special issue Editorial
    Dorigo, Marco
    Hamann, Heiko
    Lopez-Ibanez, Manuel
    Garcia-Nieto, Jose
    Engelbrecht, Andries
    Pinciroli, Carlo
    Strobel, Volker
    Camacho-Villalon, Christian
    SWARM INTELLIGENCE, 2024, 18 (2-3) : 101 - 103
  • [7] ECMP 2022 special issue editorial
    Gilligan, Paddy
    Zaidi, Habib
    Fix, Michael K.
    PHYSICA MEDICA-EUROPEAN JOURNAL OF MEDICAL PHYSICS, 2024, 125
  • [8] Editorial: Special issue on ARES 2022
    Coppa, Emilio
    Schrittwieser, Sebastian
    COMPUTERS & SECURITY, 2024, 138
  • [9] Editorial (ESREF 2022 Special issue)
    Iannuzzo, Francesco
    Altmann, Frank
    Meneghini, Matteo
    Marc, Francois
    Wittler, Olaf
    MICROELECTRONICS RELIABILITY, 2022, 138
  • [10] Special Issue on ICSC 2022 Guest Editorial
    D'Auria, Daniela
    INTERNATIONAL JOURNAL OF SEMANTIC COMPUTING, 2022, 16 (04) : 471 - 472