Printed Circuit-based Thermoelectric Sensor Film for Temperature Distribution Measurements

被引：0

作者：

Immonen, Antti ^{[1
]}

Goel, Priyanka ^{[2
]}

Koskinen, Tomi ^{[2
]}

Pekkanen, Matias ^{[1
]}

Tittonen, Ilkka ^{[2
]}

Karkkainen, Tommi ^{[1
]}

Silventoinen, Pertti ^{[1
]}

Kuisma, Mikko ^{[1
]}

机构：

[1] LUT Univ, Lappeenranta, Finland

[2] Aalto Univ, Espoo, Finland

来源：

2024 IEEE INTERNATIONAL INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE, I2MTC 2024 | 2024年

关键词：

Thermoelectric; Thermocouple; Temperature distribution; Heat Flux; Flexible Printed Circuit; Sensor;

D O I：

10.1109/I2MTC60896.2024.10561216

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Augmented measurements of temperature distributions and the movement of heat are possible with multichannel, bendable temperature sensor films. In this paper, a method for manufacturing a laterally configured thermoelectric thermal distribution sensor structure based on printed circuit technology is presented. The proposed device incorporates an array of in-plane single-pair thermocouples into a flexible substrate. The design and prototype manufacturing process of the sensor are detailed. The results of preliminary characterization tests show that the developed sensor can be used to roughly map changes in in-plane thermal fields.

引用

页数：6

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