Microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under ultrasonic waves

被引：0
|
作者：
Niu, Hongwei [1 ]
Bian, Hong [2 ,3 ]
Wang, Jian [1 ]
Song, Xiaoguo [2 ,3 ]
Zhao, Hongyun [2 ,3 ]
机构：
[1] Jiangsu Univ Technol, Sch Mat Engn, Changzhou 213001, Peoples R China
[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[3] Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China
来源：
WELDING IN THE WORLD | 2025年
基金：
中国国家自然科学基金;
关键词：
Ultrasonic-assisted soldering; Interfacial reaction; Intermetallic joints; Microstructure evolution; Growth kinetics; SOLDER; JOINTS; RELIABILITY; ASSISTANCE; DEVICES;
D O I：
10.1007/s40194-025-01926-6
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound (IMC) in a Cu/Sn/Cu interconnection during ultrasonic-assisted transient liquid phase (TLP) soldering were studied. Being different from the symmetrical growth during isothermal aging without ultrasonic waves (USW), highly asymmetrical growth of Cu6Sn5 at the upper and lower Sn/Cu interfaces was observed with USW. Cu6Sn5 grains exhibited scallop-type morphology and were discrete at the upper interface; while that at the lower Sn/Cu interface exhibited column-type morphology and were conterminous at the lower interface. USW induced Cu atom migration from the upper Cu surface to the lower interface, providing a sufficient atomic flux for rapid Cu6Sn5 formation at the lower interface and creating cavitation pits on the upper Cu surface. A growth model was developed to explain the Cu6Sn5 IMC kinetics, suggesting a reaction-controlled growth mechanism.
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页数：8
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