Microfabrication of Black Ge by SF6/O2-and C4F8-based Deep Reactive Ion Etching

被引:0
|
作者
Tohnishi, Mie [1 ]
Matsushita, Sachiko [2 ,3 ]
Matsutani, Akihiro [1 ]
机构
[1] Inst Sci Tokyo, Res Infrastruct Management Ctr, R2-3,4259 Nagatsuta Cho,Midori Ku, Yokohama, Kanagawa 2268503, Japan
[2] Inst Sci Tokyo, Dept Mat Sci & Engn, J2-48,4259 Nagatsuta Cho,Midori Ku, Yokohama, Kanagawa 2268503, Japan
[3] elleThalmo Ltd, Inst Sci Tokyo, INDEST 3F,3-3-6 Shibaura,Minato Ku, Tokyo 1080023, Japan
关键词
microfabrication; black Ge; deep RIE; regular reflectance; emissivity; SOLAR-CELLS;
D O I
10.18494/SAM5404
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
We fabricated black Ge with numerous needlelike microstructures by SF6/O2- and C4F8based deep reactive ion etching and measured the regular reflectance in the ultraviolet-to-nearinfrared range, thermal radiation properties, and electrical resistance for electrode applications. The regular reflectance of black Ge was very low in the range of 250 nm-2.5 mu m. The emissivity of the black Ge surface was observed to be the same as that of a carbon plate. We found that the scallops on the sidewalls of the microstructures also contributed to the low reflectance. Furthermore, the black Ge electrode had a lower resistance than a planar Ge electrode. The black Ge electrode, which has an increased surface area of Ge with numerous needlelike microstructures, has high emissivity, antireflectivity and low resistance, and we consider that it is useful for application to device fabrication utilizing these properties.
引用
收藏
页数:12
相关论文
共 50 条
  • [1] Formation mechanism of multi-functional black silicon based on optimized deep reactive ion etching technique with SF6/C4F8
    Zhu FuYun
    Zhang XiaoSheng
    Zhang HaiXia
    SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2015, 58 (02) : 381 - 389
  • [2] Formation mechanism of multi-functional black silicon based on optimized deep reactive ion etching technique with SF6/C4F8
    ZHU Fu Yun
    ZHANG Xiao Sheng
    ZHANG Hai Xia
    Science China(Technological Sciences), 2015, (02) : 381 - 389
  • [3] Formation mechanism of multi-functional black silicon based on optimized deep reactive ion etching technique with SF6/C4F8
    FuYun Zhu
    XiaoSheng Zhang
    HaiXia Zhang
    Science China Technological Sciences, 2015, 58 : 381 - 389
  • [4] Comparison of deep silicon etching using SF6/C4F8 and SF6/C4F6 plasmas in the Bosch process
    Rhee, Hyongmoo
    Kwon, Hyeokkyu
    Kim, Chang-Koo
    Kim, HyunJung
    Yoo, Jaisuk
    Kim, Yil Wook
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2008, 26 (02): : 576 - 581
  • [5] EFFECT OF SF6 AND C4F8 FLOW RATE ON ETCHED SURFACE PROFILE AND GRASS FORMATION IN DEEP REACTIVE ION ETCHING PROCESS
    Sharma, Pallavi
    Pleil, Matthias
    Jackson, Nathan
    PROCEEDINGS OF ASME 2022 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE2022, VOL 9, 2022,
  • [6] Deep reactive ion etching of 4H-SiC via cyclic SF6/O2 segments
    Luna, Lunet E.
    Tadjer, Marko J.
    Anderson, Travis J.
    Imhoff, Eugene A.
    Hobart, Karl D.
    Kub, Fritz J.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2017, 27 (09)
  • [7] High speed anisotropic etching of quartz using SF6/C4F8/Ar/O2 based chemistry in inductively coupled plasma reactive ion etching system
    Goyal, Abhijat
    Hood, Vincent
    Tadigadapa, Srinivas
    RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/ MOEMS V, 2006, 6111
  • [8] SILICON DEEP GROOVE REACTIVE ION ETCHING USING C2C1F5 AND SF6 MIXTURE GAS
    JEON, YJ
    PARK, SH
    YOO, HJ
    PARK, SC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (03) : C119 - C119
  • [9] Characterization of reactive ion etching of benzocyclobutente in SF6/O2 plasmas
    Chen, Qianwen
    Wang, Zheyao
    Tan, Zhiming
    Liu, Litian
    MICROELECTRONIC ENGINEERING, 2010, 87 (10) : 1945 - 1950
  • [10] A MECHANISTIC STUDY OF SF6/O2 REACTIVE ION ETCHING OF MOLYBDENUM
    PARK, SJ
    SUN, CP
    PURTELL, RJ
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (05): : 1372 - 1373