Al wiring and Cu wiring connection by newly established AL ribbon stack bonding technology for Power package and module

被引：0

作者：

Numata, Noriko ^{[1
]}

Aoki, Takashi ^{[2
]}

Hasegawa, Koichi ^{[1
]}

Nejiki, Manabu ^{[1
]}

Yamamura, Ken ^{[3
]}

Nakagawa, Kazuyuki ^{[1
]}

机构：

[1] Renesas Elect Corp, Global Packaging & Assembly Div, Gunma, Japan

[2] Renesas Elect Corp, DWP Silicon Design Technol Dept, Gunma, Japan

[3] Renesas Elect Corp, Assembly Engn Dept, Tokyo, Japan

来源：

2024 13TH IEEE CPMT SYMPOSIUM JAPAN, ICSJ 2024 | 2024年

关键词：

Al ribbon; stacked bonding; low RDS;

D O I：

10.1109/ICSJ62869.2024.10804756

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

For low RDS (drain-source on-resistance) required for future automotive devices, a newly Al ribbon stacked technology was established in which Al ribbon is placed on top of Al pad and connected Al or Cu wire.

引用

页码：21 / 24

页数：4