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- [3] Reliability Improvement of CBGA Solder Ball Joint in LTCC-based SiP Module 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 656 - 661
- [6] Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 85 - 89
- [7] Heat Dissipation Based on LTCC - HTCC Heterostructure PROCEEDINGS OF THE 2014 37TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) - ADVANCES IN ELECTRONIC SYSTEM INTEGRATION, 2014, : 7 - 10
- [8] Noise Isolation of PDN Using In-Package Filter in LTCC-Based System-in-Package (SiP) 2018 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 2018 IEEE ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC/APEMC), 2018, : 434 - 436
- [9] 3D strip meander delay line structure for multilayer LTCC-based SiP applications 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 2081 - +