Study on Nonlinear Characteristics on Conductivity of Silicon Carbide Whisker/Epoxy Resin Composites

被引:0
|
作者
Chi, Qingguo [1 ,2 ]
Cui, Shuang [1 ,2 ]
Zhang, Tiandong [1 ,2 ]
Yang, Meng [1 ,2 ]
Chen, Qingguo [1 ,2 ]
机构
[1] Key Laboratory of Engineering Dielectrics and Its Application Ministry of Education, Harbin University of Science and Technology, Harbin,150080, China
[2] School of Electrical and Electronic Engineering, Harbin University of Science and Technology, Harbin,150080, China
关键词
Epoxy resins;
D O I
10.19595/j.cnki.1000-6753.tces.191168
中图分类号
学科分类号
摘要
引用
收藏
页码:4405 / 4414
相关论文
共 50 条
  • [1] Effect of Temperature and Frequency on AC Nonlinear Properties of Epoxy Resin/Silicon Carbide Whisker Composites
    Chen X.
    Huang X.
    Wang Q.
    Wang E.
    Zhang T.
    Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2022, 37 (15): : 3897 - 3912
  • [2] Nonlinear conductivity and breakdown strength characteristics of silicon carbide and hexagonal boron nitride co-doped epoxy resin composites
    Chi, Qingguo
    Cui, Shuang
    Zhang, Tiandong
    Yang, Meng
    Zhang, Yongquan
    Zhang, Changhai
    Lei, Qingquan
    AIP ADVANCES, 2020, 10 (05)
  • [3] Improved Thermal Conductivity of Silicon Carbide/Carbon Fiber/Epoxy Resin Composites
    Ma, Ai-jie
    Li, Hongchun
    Chen, Weixing
    Hou, Yonggang
    POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING, 2013, 52 (03) : 295 - 299
  • [4] A study on thermal conductivity enhancement of silicon carbide filler glass fiber epoxy resin hybrid composites
    Vaggar, Gurushanth B.
    Kamate, S. C.
    Badyankal, Pramod, V
    MATERIALS TODAY-PROCEEDINGS, 2021, 35 : 330 - 334
  • [5] Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials
    Chen, Xiangrong
    Wang, Qilong
    Huang, Xiaofan
    Awais, Muhammad
    Paramane, Ashish
    Ren, Na
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (07): : 1109 - 1121
  • [6] A study on thermal conductivity and thermogravimetric analysis of glass fiber epoxy resin composites modified with silicon carbide and copper nanoparticles
    Vaggar, Gurushanth B.
    Kamate, S. C.
    Nadaf, S. L.
    MATERIALS TODAY-PROCEEDINGS, 2022, 66 : 2308 - 2314
  • [7] Electrical conductivity of epoxy composites with silicon carbide powder filler
    Luniov, S. V.
    Khvyshchun, M. V.
    Koval, Y. V.
    Tsyz, A. I.
    FUNCTIONAL MATERIALS, 2023, 30 (03): : 398 - 402
  • [8] Tailoring Electric Field Distortion in High-Voltage Power Modules Utilizing Epoxy Resin/Silicon Carbide Whisker Composites with Field-Dependent Conductivity
    Wang, Qilong
    Chen, Xiangrong
    Huang, Xiaofan
    Muhammad, Awais
    Shi, Yiwen
    Dai, Chao
    Ren, Na
    Paramane, Ashish
    ACS APPLIED ELECTRONIC MATERIALS, 2022, 4 (01) : 478 - 493
  • [9] SUPER-HYDROPHOBIC SILICON CARBIDE REINFORCED EPOXY RESIN COMPOSITES
    Yan S.
    Tang J.
    Jin Z.
    Qi F.
    Zhang A.
    Zhou A.
    Surface Review and Letters, 2023, 30 (07)
  • [10] Fabrication and mechanical properties of silicon carbide nanowires/epoxy resin composites
    Nhuapeng, W.
    Thamjaree, W.
    Kumfu, S.
    Singjai, P.
    Tunkasiri, T.
    CURRENT APPLIED PHYSICS, 2008, 8 (3-4) : 295 - 299