Sintering behavior of Silver-Filled Anhydride-Cured Electrically Conductive Adhesives for Enhancing Interfacial Conductivity

被引：0
|
作者：
Fukushima, Takanori [1 ]
Inoue, Masahiro [1 ]
机构：
[1] Graduate School Of Science And Technology, Gunma University, Ota, Japan
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Adhesives - Annealing - Chemical bonds - Curing - Electric conductivity - Electrodes - Electronics packaging - Resins - Silver - Silver compounds - Temperature
引用
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页码：217 / 218
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