Process modeling with neural networks using small experimental datasets

被引:0
|
作者
Ctr. de Rech. en Pates et Papiers, Univ. Quebec Trois-Rivieres, P.O. B., Trois-Rivières, Canada [1 ]
不详 [2 ]
机构
来源
Comput. Chem. Eng. | / 9卷 / 1167-1176期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Process modeling with neural networks using small experimental datasets
    Lanouette, R
    Thibault, J
    Valade, JL
    COMPUTERS & CHEMICAL ENGINEERING, 1999, 23 (09) : 1167 - 1176
  • [2] Neural network modeling for small datasets
    Ingrassia, S
    Morlini, I
    TECHNOMETRICS, 2005, 47 (03) : 297 - 311
  • [3] Photolithography process modeling using neural networks
    Univ of L'Aquila, L'Aquila, Italy
    Semicond Int, 6 (5pp):
  • [4] Process modeling using stacked neural networks
    Sridhar, DV
    Seagrave, RC
    Bartlett, EB
    AICHE JOURNAL, 1996, 42 (09) : 2529 - 2539
  • [5] Experiment on Handwriting Generation with Recurrent Neural Networks using Small Datasets
    Liu, Yushun
    Liu, Liguo
    Miao, Xuhui
    2021 5TH INTERNATIONAL CONFERENCE ON ARTIFICIAL INTELLIGENCE AND VIRTUAL REALITY, AIVR 2021, 2021, : 123 - 127
  • [6] Semantic segmentation on small datasets of satellite images using convolutional neural networks
    Younis, Mohammed Chachan
    Keedwell, Edward
    JOURNAL OF APPLIED REMOTE SENSING, 2019, 13 (04)
  • [7] Modeling the hydrocracking process using artificial neural networks
    Elkamel, A
    Al-Ajmi, A
    Fahim, M
    PETROLEUM SCIENCE AND TECHNOLOGY, 1999, 17 (9-10) : 931 - 954
  • [8] Using artificial neural networks in the modeling of the hydrocracking process
    Elkamel, A
    Al-Ajmi, A
    Fahim, M
    Al-Sahhaf, T
    PROCEEDINGS OF THE SIMULATORS INTERNATIONAL XV, 1998, 30 (03): : 23 - 28
  • [9] Modeling the hydrocracking process using artificial neural networks
    Elkamel, Ali
    Al-Ajmi, Ali
    Fahim, Mohammed
    Petroleum Science and Technology, 1999, 17 (09): : 931 - 954
  • [10] Modeling the laser ablation process using neural networks
    Setia, R
    May, GS
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 161 - 167