An amino-terminated oligoimide was prepared by Michael addition reaction of N, N′-1,4-phenylene bismaleimide (PBM) and 4,4′-diamino-diphenyl methane (DDM) at a PBM-DDM ratio of 1:2. The poly(amido-imide)s (PAIs) were prepared by condensation of this PBM-DDM oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, IR spectral studies, number-average molecular weight (Mn), estimated by nonaqueous conductometric titration, and thermogravimetry. The curing reaction of the epoxy resin-, namely diglycidyl ether of bisphenol-A (DGEBA)-, PAI system was monitored by differential scanning calorimetry (DSC). Based on cure temperature, the glass- and carbon-fibre-reinforced composites (i.e. laminates) of the PAI-epoxy resin system have also been prepared and characterized.