TELECOM CHIPS FOR THE HICOM ISDN COMMUNICATION SYSTEM.

被引：0
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作者：
Beckinger, Guenther [1 ]
机构：
[1] Siemens AG, Munich, West Ger, Siemens AG, Munich, West Ger
来源：
Telcom Report (English Edition) | 1986年 / 9卷 / 01期
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页码：43 / 46
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