VLSI interconnection modelling using a finite element approach

被引：0
|
作者：
Kumar, Umesh
机构：
来源：
Active and Passive Electronic Components | 1995年 / 18卷 / 03期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：179 / 202
相关论文
共 50 条
  • [1] Inductance in VLSI interconnection modelling
    Moll, F
    Roca, M
    Rubio, A
    IEE PROCEEDINGS-CIRCUITS DEVICES AND SYSTEMS, 1998, 145 (03): : 175 - 179
  • [2] Vibration modelling of structural networks using a hybrid finite element/wave and finite element approach
    Renno, Jamil M.
    Mace, Brian R.
    WAVE MOTION, 2014, 51 (04) : 566 - 580
  • [3] FINITE ELEMENT MODELLING OF FABRIC TENSILE BEHAVIOUR USING AN AUTOMATIC MODELLING APPROACH
    Lin, H.
    Clifford, M. J.
    Long, A. C.
    Sherburn, M.
    Ramgulam, R.
    Potluri, P.
    86TH TEXTILE INSTITUTE WORLD CONFERENCE, VOL 3, CONFERENCE PROCEEDINGS, 2008,
  • [4] A Finite Difference Groundwater Modelling and Comparison of the Results with Those Obtained Using Finite element modelling approach
    Kamkar-Rouhani, Abolghasem
    MINE WATER AND THE ENVIRONMENT, PROCEEDINGS, 2008, : 449 - 452
  • [5] Modelling of flexible pavements using the finite element method and a simplified approach
    Akou, Y
    Heck, JV
    Kazai, A
    Hornych, P
    Odéon, H
    Piau, JM
    UNBOUND GRANULAR MATERIALS: LABORATORY TESTING, IN-SITU TESTING AND MODELLING, 1999, : 207 - 220
  • [6] Electromigration Analysis of VLSI Circuits Using the Finite Element Method
    Thiele, Matthias
    Bigalke, Steve
    Lienig, Jens
    VLSI-SOC: OPPORTUNITIES AND CHALLENGES BEYOND THE INTERNET OF THINGS, 2019, 500 : 133 - 152
  • [7] Modelling of a flexible robot manipulator using finite element methods: A symbolic approach
    Tokhi, MO
    Mohamed, Z
    Hashim, AWI
    JOURNAL OF LOW FREQUENCY NOISE VIBRATION AND ACTIVE CONTROL, 1999, 18 (02): : 63 - 76
  • [8] An infinite tube approach for the efficient modelling of collapse using the finite element method
    Provasi, Rodrigo
    Toni, Fernando Geremias
    Martins, Clovis de Arruda
    MARINE STRUCTURES, 2022, 82
  • [9] An investigation of the impact of a Ti barrier metal on the thermal stress field in passivated aluminium lines and vias in VLSI systems using finite element modelling approach
    Igic, PM
    Mawby, PA
    INTERNATIONAL JOURNAL OF ELECTRONICS, 2000, 87 (11) : 1289 - 1299
  • [10] Finite element modelling of the thermal stress field during processing of VLSI multilevel structures
    Igic, PM
    Mawby, PA
    ELECTRONICS LETTERS, 1998, 34 (05) : 471 - 472
12345