PACKAGING & PRODUCTION.

Various types of electronic circuit packaging techniques are reviewed. Chip carriers, plastic leaded and ceramic leadless types are presented, with the latter type used as viable package for large scale integrated circuits. In anticipation of packaging densities and heat dissipation needs in very large scale integrated circuits new carrier prototypes are being introduced and beryllium oxide is proposed as a substrate and packaging material that dissipates heat more efficiently than aluminum. Improved electron-beam lithography machines and other IC processing equipment are considered. As the lead count of VLSI exceeds 100, new pin configurations or pinless designs are considered.