60-GHz flip-chip assembled MIC design considering chip-substrate effect

被引：0
|
作者：
Arai, Yukari [1 ]
Sato, Masakatsu [1 ]
Yamada, Hiromi T. [1 ]
Hamada, Tomoji [1 ]
Nagai, Kiyoshi [1 ]
Fujishiro, Hiroki I. [1 ]
机构：
[1] Oki Electric Industry Co, Ltd, Tokyo, Japan
来源：
IEEE Transactions on Microwave Theory and Techniques | 1997年 / 45卷 / 12 pt 2期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：2261 / 2266
相关论文
共 50 条
  • [1] 60-GHz flip-chip assembled MIC design considering chip-substrate effect
    Arai, Y
    Sato, M
    Yamada, HT
    Hamada, T
    Nagai, K
    Fujishiro, HI
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (12) : 2261 - 2266
  • [2] 60GHz flip-chip assembled MIC design considering chip-substrate effect
    Arai, Y
    Sato, M
    Yamada, HT
    Hamada, T
    Nagai, K
    Fujishiro, HI
    1997 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS I-III: HIGH FREQUENCIES IN HIGH PLACES, 1997, : 447 - 450
  • [3] Optimization of flip-chip transitions for 60-GHz packages
    Kam, Dong Gun
    IEICE ELECTRONICS EXPRESS, 2014, 11 (12):
  • [4] Flip-Chip interconnection effects on 60-GHz microstrip antenna performance
    Victoria Research Laboratory, Nationa ICT Australia, Parkville, VIC 3010, Australia
    IEEE Antennas Wirel. Propag. Lett., 2009, (283-286):
  • [5] Flip-Chip Interconnection Effects on 60-GHz Microstrip Antenna Performance
    Felic, G.
    Skafidas, S.
    IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2009, 8 : 283 - 286
  • [6] Flip-chip interconnection effects on 60-GHz microstrip antenna performance
    Felic, G.
    Skafidas, S.
    IEEE Antennas and Wireless Propagation Letters, 2009, 8 : 283 - 286
  • [7] A 60GHz LC-VCO Module using Flip-Chip on a Laminate Substrate
    Notten, M.
    Veenstra, H.
    Huang, X.
    Mills, J. B.
    2009 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2009, : 1768 - +
  • [8] A 60GHz LC-VCO Module using Flip-Chip on a Laminate Substrate
    Notten, M.
    Veenstra, H.
    Huang, X.
    Mills, J. B.
    2009 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC 2009), 2009, : 415 - +
  • [9] Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band
    Akkermans, J. A. G.
    Kazim, M. I.
    Yu, Y.
    Herben, M. H. A. J.
    Baltus, P. G. M.
    Smulders, P. F. M.
    2009 3RD EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, VOLS 1-6, 2009, : 2716 - 2720
  • [10] Micromachined 60 GHz postsupported patch antenna with flip-chip interconnect
    Deng, Changjiang
    Liu, Wendong
    Hao, Qing
    Feng, Zhenghe
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2015, 57 (11) : 2706 - 2710
12345