New flip-chip bonding technology for superconducting IC

被引：0

作者：

机构：

[1] Ogashiwa, Toshinori

[2] Nakagawa, Hiroshi

[3] Akimoto, Hideyuki

[4] Shigyo, Hiroyuki

[5] Takada, Susumu

来源：

Ogashiwa, Toshinori | 1600年 / 31期

关键词：

Bonding - Electric Conductors; Wire - Electric Contacts - Niobium And Alloys--Films;

D O I：

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学科分类号：

摘要：

A new flip-chip bonding method for achieving superconducting electrical contacts has been developed by employing a rapidly solidified Pb-2Sn-0.1Cu-0.5Sb (wt%) alloy wire. The solder balls were made from the wire by means of arc discharge in Ar gas containing H2. The bumps were thermosonically fabricated on the Pb-20Sn film deposited on the mullite substrate. Subsequently, a Si chip coated with Nb/Au films was bonded on the substrate using those bumps by means of the thermal compression method. This method has a significant advantage of reducing the elevated temperature for flip-chip bonding to below 100°C.

引用

共 50 条

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