Intelligent X-ray inspection for quality control of solder joints

被引：0
|
作者：
Fraunhofer Inst for Integrated, Circuits, Erlangen, Germany [1 ]
机构：
来源：
IEEE Trans Compon Packag Manuf Technol Part C | / 2卷 / 111-120期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Improvements to X-ray laminography for automated inspection of solder joints
    Sankaran, Vijay
    Kalukin, Andrew R.
    Kraft, Russell P.
    IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 1998, 21 (02): : 148 - 154
  • [2] X-ray inspection of lead-free solder joints
    Roth, H
    Electronics Goes Green 2004 (Plus): Driving Forces for Future Electronics, Proceedings, 2004, : 1053 - 1054
  • [3] An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography
    Kalukin, AR
    Sankaran, V
    Chartrand, B
    Millard, DL
    Kraft, RP
    Embrechts, MJ
    NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 438 - 445
  • [4] X-ray inspection of ball-grid array solder joints
    Bauscher, I
    Hanke, R
    ANNUAL MEETING 1998 - NONDESTRUCTIVE MATERIALS TESTING: NONDESTRUCTIVE TESTING OF WELD JOINTS 70 YEARS LATER, 1997, 63 (1-2): : 101 - 108
  • [5] 3D X-ray Based BGA Solder Joints Inspection Algorithm
    Zhang Ruiqiu
    Zhang Xianmin
    Chen Zhong
    APPLIED MECHANICS AND MECHANICAL ENGINEERING, PTS 1-3, 2010, 29-32 : 502 - 507
  • [6] Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints
    Nathália Mattos Terra
    Sandro Breval Santiago
    Adalena Kennedy Vieira
    Raimundo Kennedy Vieira
    The International Journal of Advanced Manufacturing Technology, 2024, 131 : 5897 - 5904
  • [7] Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints
    Terra, Nathalia Mattos
    Santiago, Sandro Breval
    Vieira, Adalena Kennedy
    Vieira, Raimundo Kennedy
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2024, 131 (12): : 5897 - 5904
  • [8] Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
    Schmidt, Konstantin
    Thielen, Nils
    Voigt, Christian
    Seidel, Reinhardt
    Franke, Joerg
    Milde, Yannik
    Boenig, Jochen
    Beitinger, Gunter
    2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020), 2020, : 26 - 31
  • [9] Automatic solder joint inspection system by X-ray imaging
    Hamada, Toshimitsu
    Nakahata, Kozo
    Fushimi, Satoru
    Morioka, Yoshifumi
    Nishida, Takehiko
    Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 1993, 59 (01): : 65 - 71
  • [10] Lead-free solder drives X-ray inspection
    Mathiszik, B
    Roth, H
    EE-EVALUATION ENGINEERING, 2004, 43 (10): : 36 - +
12345