Dynamic Recrystallization in Tension-Deformed Silver Single Crystals.

The recrystallization during high-temperature tensile deformation of silver single crystals, oriented for single slip, was investigated. It has been found that this dynamic recrystallization is initiated when a defined level of flow stress is attained. This recrystallization stress was observed to decrease with increasing temperature or decreasing strain rate and corresponds to the steady state flow stress at very high temperatures. Compared at equivalent deformation conditions, the normalized recrystallization stress of silver is larger than for copper but lower than for Cu-9% Ge single crystals. The orientations of the recrystallized grains are related to the deformation structure by subgrain growth and twinning to high generations.