共 50 条
- [1] Automatic Wire Bonder Designed for MEMS Packaging DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2008, : 21 - 23
- [2] Gold Wire Stress Analysis of Wire Feed System in Automatic Wire Bonder 2009 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION, VOLS 1-7, CONFERENCE PROCEEDINGS, 2009, : 364 - 368
- [3] Stress model and experiment on wire feed system of automatic wire bonder Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering, 2010, 8 (01): : 31 - 36
- [4] Modeling of a Direct-drive Table for Automatic Wire Bonder MATERIALS, MECHATRONICS AND AUTOMATION, PTS 1-3, 2011, 467-469 : 1315 - 1318
- [5] A Framework of Equipment Maintenance and Service with Application to Wire Bonder 2009 IEEE/ASME INTERNATIONAL CONFERENCE ON ADVANCED INTELLIGENT MECHATRONICS, VOLS 1-3, 2009, : 1491 - +
- [6] APPLICATION OF SPRITE DETECTORS IN A LIGHTWEIGHT THERMAL IMAGER. Annual Review - Philips Research Laboratories, 1982, : 90 - 91
- [7] Application of Speed Observer for XY-stage of Wire Bonder ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3, 2013, 655-657 : 1342 - 1347
- [9] Gaussian Process Position-Dependent Feedforward: With Application to a Wire Bonder 2022 IEEE 17TH INTERNATIONAL CONFERENCE ON ADVANCED MOTION CONTROL (AMC), 2022, : 268 - 273
- [10] Research on Fast locating Solder Joint on Fully-Automatic LED Wire Bonder VIBRATION, STRUCTURAL ENGINEERING AND MEASUREMENT I, PTS 1-3, 2012, 105-107 : 1827 - 1830