Low-temperature dry etching of copper using a new chemical approach

被引：0
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作者：
Kruck, Th. [1 ]
Schober, M. [1 ]
机构：
[1] Universitaet zu Koeln, Koeln, Germany
来源：
Microelectronic Engineering | 1997年 / 37-38卷
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摘要：
11
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页码：121 / 126
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