Particle removal from semiconductor wafers by megasonic cleaning

被引：0
|
作者：
Kuehn, T.H. [1 ]
Kittelson, D.B. [1 ]
Wu, Y. [1 ]
Gouk, R. [1 ]
机构：
[1] Univ of Minnesota, Minneapolis, MN, United States
来源：
| / Pergamon Press Inc, Tarrytown卷 / 27期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Particle removal efficiency and damage analysis on silicon wafers after megasonic cleaning in solvents
    Barbagini, Francesca
    Halder, Sandip
    Janssens, Tom
    Kenis, Karine
    Wostyn, Kurt
    Bearda, Twan
    Quoc, Toan-Le
    Leunissen, Peter
    Mertens, Paul
    Kim, Kyung-Hyun
    Andreas, Michael
    [J]. Journal of Adhesion Science and Technology, 2009, 23 (12): : 1709 - 1721
  • [2] Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents
    Barbagini, Francesca
    Halder, Sandip
    Janssens, Tom
    Kenis, Karine
    Wostyn, Kurt
    Bearda, Twan
    Quoc, Toan-Le
    Leunissen, Peter
    Mertens, Paul
    Kim, Kyung-Hyun
    Andreas, Michael
    [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2009, 23 (12) : 1709 - 1721
  • [3] MEGASONIC PARTICLE REMOVAL FROM SOLID-STATE WAFERS
    SHWARTZMAN, S
    MAYER, A
    KERN, W
    [J]. RCA REVIEW, 1985, 46 (01): : 81 - 105
  • [4] Evaluation of megasonic cleaning systems for particle removal efficiency and damaging
    Vereecke, G
    Holsteyns, F
    Veltens, J
    Lux, M
    Arnauts, S
    Kenis, K
    Vos, R
    Mertens, PW
    Heyns, MM
    [J]. CLEANING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING VIII, 2004, 2003 (26): : 145 - 152
  • [5] Acoustic reflection coefficient of silicon wafers in megasonic cleaning tanks
    Zang, M
    Kittelson, DB
    Kuehn, TH
    Gouk, R
    [J]. 1997 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 & 2, 1997, : 833 - 836
  • [6] AN EXPERIMENTAL-STUDY OF MEGASONIC CLEANING OF SILICON-WAFERS
    BUSNAINA, AA
    KASHKOUSH, II
    GALE, GW
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (08) : 2812 - 2817
  • [7] Development of a Near-field Megasonic Cleaning System for Nano-particle Removal
    Kim, Hyunse
    Lee, Yanglae
    Lim, Euisu
    [J]. ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES XI, 2013, 195 : 205 - 208
  • [8] MEGASONIC CLEANING - NEW CLEANING AND DRYING SYSTEM FOR USE IN SEMICONDUCTOR PROCESSING
    MAYER, A
    SHWARTZMAN, S
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1979, 8 (06) : 855 - 864
  • [9] Streaming and removal forces due to second-order sound field during megasonic cleaning of silicon wafers
    Deymier, PA
    Vasseur, JO
    Khelif, A
    Djafari-Rouhani, B
    Dobrzynski, L
    Raghavan, S
    [J]. JOURNAL OF APPLIED PHYSICS, 2000, 88 (11) : 6821 - 6835
  • [10] Removal of silica particles from silicon substrates using megasonic cleaning
    Busnaina, AA
    Gale, GW
    [J]. PARTICULATE SCIENCE AND TECHNOLOGY, 1997, 15 (3-4) : 361 - 369
12345