Integrated cleaning: Application of densified fluid cleaning (DFC) to post-etch residue removal

被引：0
|
作者：
Starov, V. [1 ]
Beery, D. [1 ]
Kabansky, A. [1 ]
机构：
[1] GaSonics Int, San Jose, CA, United States
来源：
Solid State Phenomena | 1999年 / 65-66卷
关键词：
Etching - Particles (particulate matter) - Scanning electron microscopy - Surface cleaning;
D O I：
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中图分类号：
学科分类号：
摘要：
Post-etch residue removal is emerging as one of the most challenging problems IC manufacturers face today. To solve this problem, GaSonics has developed a dry cleaning method, densified fluid cleaning (DFC), which shown a successful results. It is based on application of densified gases at elevated pressures and low temperatures. DFC lends itself to removal of residues, metallics and particles in the way similar to liquid-based cleaning techniques. At the same time, DFC has the advantages of the dry methods: lower cost, improved safety, and reduced environmental impact.
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页码：195 / 198
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