Substrates of Thick Film Hybrid Circuits.

被引：0
|
作者：
Sztaba, Olgierda
Lusniak-Wojcicka, Danuta
Gandurska, Joanna
机构：
来源：
Elektronika Warszawa | 1981年 / 22卷 / 06期
关键词：
INTEGRATED CIRCUITS; THICK FILM;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The properties of ceramic substrates for thick-film techniques, in particular alumina substrates containing 96% Al//2O//3, are presented. Some new types of substrates are discussed i. e. substrates of glass with controlled devitrification, metal substrates with layers of Al//2O//3 produced by the plasma beam method and porcelain enameled steel substrates. Their advantages and disadvantages are discussed.
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页码：7 / 9
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