Dispersibility of copper-plating sulfate electrolytes containing nitrate ions

被引：0

作者：

Braun, E.V. ^{[1
]}

Savel'ev, M.I. ^{[1
]}

Kruglikov, S.S. ^{[1
]}

Yarlykov, M.M. ^{[1
]}

Myagkova, S.I. ^{[1
]}

机构：

[1] D.I. Mendeleev Inst of Chemical, Technology, Russia

来源：

Protection of Metals (English translation of Zaschita Metallov) | 1988年 / 24卷 / 02期

关键词：

Compact Copper Deposition - Copper Current Density - Copper Plating Sulfate Electrolytes - Electrolyte Dispersibility - Metal Dispersibility;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：238 / 240

共 50 条

[1] DISPERSIBILITY OF COPPER-PLATING SULFATE ELECTROLYTES CONTAINING NITRATE IONS
BRAUN, EV
SAVELEV, MI
KRUGLIKOV, SS
YARLYKOV, MM
MYAGKOVA, SI
PROTECTION OF METALS, 1988, 24 (02): : 238 - 240
[2] PHOSPHATE-IONS EFFECT ON THE PROCESS OF DIRECT ALUMINUM COPPER-PLATING IN PYROPHOSPHATE ELECTROLYTES
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LUKOMSKII, YY
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[3] STABILITY OF ALKYLAMINEAMMONIATE COPPER-PLATING ELECTROLYTES AND THE QUALITY OF THE OBTAINED COATINGS.
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Slotin, Yu.S.
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[4] COMPARATIVE CHARACTERIZATION OF THE THROWING POWER OF COPPER-PLATING ELECTROLYTES IN MODEL CELLS
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[5] COMPARATIVE CHARACTERIZATION OF THE THROWING POWER OF COPPER-PLATING ELECTROLYTES IN ANGLE CELLS
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[6] ELECTRODEPOSITION OF COPPER FROM ACID ELECTROLYTES CONTAINING NITRATE IONS
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YARLYKOV, MM
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GLOVATSKAYA, OV
CHERKASOV, MY
PROTECTION OF METALS, 1990, 26 (03): : 379 - 381
[7] MECHANISM OF CORROSION OF COPPER IN NITRATE COPPER PLATING ELECTROLYTES
ANTROPOV, LI
DONCHENKO, MI
MOTRONYUK, TI
PROTECTION OF METALS, 1984, 20 (01): : 27 - 32
[8] MECHANISM OF CORROSION OF COPPER IN NITRATE COPPER PLATING ELECTROLYTES.
Antropov, L.I.
Donchenko, M.I.
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Protection of Metals (English translation of Zaschita Metallov), 1984, 20 (01): : 27 - 32
[9] MODERN BATHS FOR ELECTROLYTIC COPPER-PLATING
不详
MECHANIK MIESIECZNIK NAUKOWO-TECHNICZNY, 1975, 48 (11): : 591 - 591
[10] CHEMICAL COPPER-PLATING AND NICKEL-PLATING OF PLASTICS
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MECHANIK MIESIECZNIK NAUKOWO-TECHNICZNY, 1974, 47 (08): : 471 - 471

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