Correlation between the oxidation state of α-SiC and its wettability with non-reactive (Sn) or reactive (Ni) metallic components and their binary Si-alloys

被引：0
|
作者：
Univ of Patras, Patras, Greece [1 ]
机构：
来源：
Acta Mater | / 9卷 / 3515-3525期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Interfaces (materials)
引用
收藏
相关论文
共 11 条
  • [1] Correlation between the oxidation state of alpha-SiC and its wettability with non-reactive (Sn) or reactive (Ni) metallic components and their binary Si-alloys
    Tsoga, A
    Ladas, S
    Nikolopoulos, P
    ACTA MATERIALIA, 1997, 45 (09) : 3515 - 3525
  • [2] Influence of atmosphere on the wettability of alpha-SiC by non-reactive Cu-Si alloys
    Gasse, A
    Chaumat, G
    Rado, C
    Eustathopoulos, N
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1996, 15 (18) : 1630 - 1632
  • [3] Kinetics of solid-state reactive diffusion between Sn-Ni alloys and Pd
    Tanaka, S.
    Kajihara, M.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 484 (1-2) : 273 - 279
  • [4] Kinetics of solid-state reactive diffusion between Sn-Ni alloys and Pd
    Tanaka, S.
    Kajihara, M.
    Journal of Alloys and Compounds, 2009, 484 (1-2): : 273 - 279
  • [5] Experimental Observation on Solid-State Reactive Diffusion between Sn-Ag Alloys and Ni
    Nakayama, Misako
    Minho, O.
    Kajihara, Masanori
    MATERIALS TRANSACTIONS, 2017, 58 (04) : 561 - 566
  • [6] Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn–58Bi and Cu Pad
    Ashutosh Sharma
    Ashok K. Srivastava
    Kwan Lee
    Byungmin Ahn
    Metals and Materials International, 2019, 25 : 1027 - 1038
  • [7] Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn-58Bi and Cu Pad
    Sharma, Ashutosh
    Srivastava, Ashok K.
    Lee, Kwan
    Ahn, Byungmin
    METALS AND MATERIALS INTERNATIONAL, 2019, 25 (04) : 1027 - 1038
  • [8] The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
    Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei, 10672, Taiwan
    不详
    不详
    Journal of Alloys and Compounds, 2007, 440 (1-2): : 333 - 340
  • [9] The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
    Lin, Chung-Yung
    Jao, Chien-Chung
    Lee, Chiapyng
    Yen, Yee-Wen
    JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 440 (1-2) : 333 - 340
  • [10] Surface characterization of Mo-implanted 6H-SiC by high temperature non-reactive wetting tests with the Ni-56Si alloy
    Zhao, S. T.
    Valenza, F.
    Liu, G. W.
    Muolo, M. L.
    Qiao, G. J.
    Passerone, A.
    CERAMICS INTERNATIONAL, 2014, 40 (05) : 7227 - 7234
12