MAKE AND BREAK PROPERTIES OF ELECTRODEPOSITS.

被引:0
|
作者
Grossmann, Hermann [1 ]
Huck, M. [1 ]
Schaudt, Gerd [1 ]
Wagner, F.J. [1 ]
机构
[1] DODUCO KG, Pforzheim, West Ger, DODUCO KG, Pforzheim, West Ger
关键词
ELECTRIC RELAYS - Contacts - GOLD AND ALLOYS - METALS AND ALLOYS - Thin Films - PALLADIUM AND ALLOYS - SILVER AND ALLOYS;
D O I
暂无
中图分类号
学科分类号
摘要
Properties of thin precious metal electrodeposits used as contact materials on base metals under make and break conditions are described. The investigations were carried out with the aid of a model device which simulated conditions existing in relays. The electrodeposits tested were AuCo//0//. //3, AuPd//6 Cu//2 , Pd, PdNi//2 O, Rh, and Ag/Rh sandwich. For these electrodeposits contact resistance is discussed in dependence on the number of operations for different electric loads (28-550 mA dc, 12-60 V, ohmic). At voltages below 12 V and currents below 100 mA with a 5- mu m-thick Rh, Pd, PdNi//2 O, and a 10- mu m-thick AuPd//6 Cu//2 layer more than 10**7 operations are available with no R//c (max) value above 100 m OMEGA . At the same voltage, with 5- mu m AuCo//0 //. //3 , even at a current of 30 mA only 10**6 operations are possible. Below 12 V/100 mA doubling the thickness of the layer results in a doubling of the number of operations. For all electrodeposits it is noted that at higher voltages and currents the maximum number of operations decreases significantly, nearly independently of the layer thickness.
引用
收藏
页码:70 / 79
相关论文
共 50 条
  • [1] MAKE AND BREAK PROPERTIES OF ELECTRODEPOSITS
    GROSSMANN, H
    HUCK, M
    SCHAUDT, G
    WAGNER, FJ
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (01): : 70 - 79
  • [2] WEAR PROPERTIES OF HIGH SPEED GOLD ELECTRODEPOSITS.
    Whitlaw, K.J.
    Souter, John W.
    Wright, Ian S.
    Nottingham, M.C.
    IEEE transactions on components, hybrids, and manufacturing technology, 1984, CHMT-8 (01): : 46 - 51
  • [3] USE AND PRODUCTION OF CADMIUM ELECTRODEPOSITS.
    Walker, R.
    Metal Finishing, 1974, 72 (01) : 59 - 64
  • [4] NONCRYSTALLINE Ni-P ELECTRODEPOSITS.
    de Iorio, I.
    Tagliaferri, V.
    Lanotte, L.
    Journal of Metals, 1985, 37 (11): : 48 - 50
  • [5] Influence of the basis metal on the structure of electrodeposits.
    Hothersall, AW
    TRANSACTIONS OF THE FARADAY SOCIETY, 1935, 31 (02): : 1242 - 1247
  • [6] EFFECT OF BENZOTRIAZOLE ON THE MICROHARDNESS OF COPPER ELECTRODEPOSITS.
    Vedanayaki, B.K.
    Rajagopalan, S.R.
    Journal of the Electrochemical Society of India, 1986, 35 (04): : 293 - 299
  • [7] SOME FURTHER STUDIES ON POROSITY IN GOLD ELECTRODEPOSITS.
    Morrissey, R.J.
    Weisberg, A.M.
    Transactions of the Institute of Metal Finishing, 1980, 58 (pt 3): : 97 - 103
  • [8] INFLUENCE OF THICKNESS, TEMPERATURE AND STRAIN RATE ON THE MECHANICAL PROPERTIES OF SULFAMATE NICKEL ELECTRODEPOSITS.
    Johnson, H.R.
    Dini, J.W.
    Stoltz, R.E.
    1600, (66):
  • [9] The structure and texture development of Ni alloy electrodeposits. 1. Nickel-iron electrodeposits
    Lewis, DB
    Lehmberg, CE
    Marshall, GW
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2001, 79 (02): : 60 - 67
  • [10] MASS-SPECTROMETRIC INVESTIGATION OF THE INCORPORATION OF ORGANIC MATTER INTO ELECTRODEPOSITS.
    Leisch, Manfred
    Rendulic, Klaus D.
    Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques, 1984, 75 (06): : 459 - 462