Passivation of Cu via refractory metal nitridation in an ammonia ambient

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作者：
Arizona State Univ, Tempe, United States [1 ]
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来源：
Thin Solid Films | / 1-2卷 / 199-208期
基金：
美国国家科学基金会;
关键词：
Ammonia - Annealing - Diffusion - Interfaces (materials) - Nitriding - Passivation - Refractory metals - Silica - Titanium nitride - Titanium oxides;
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